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  6. Reduction of total manufacturing costs through the modularization of hybrid ICs!

Reduction of total manufacturing costs through the modularization of hybrid ICs!

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last updated:Sep 16, 2025

IAM Electronics Co., Ltd.
IAM Electronics Co., Ltd.
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【Space-saving of circuit boards】 We simplify and miniaturize circuit boards without the hassle of component procurement or equipment. Custom products available!

Our company manufactures "Hybrid ICs" that integrate circuit design technology, assembly technology, and measurement technology based on many years of thick film manufacturing expertise. This allows for simplification and miniaturization of circuit boards without the hassle of component procurement or equipment. It also contributes to shortening development time and reducing management costs. We also accommodate production using alumina ceramic substrates, which excel in heat dissipation and heat resistance. We welcome inquiries regarding integration density, usage conditions, pricing, and delivery times. 【Features】 ■ Simplification and miniaturization of circuit boards through modularization ■ High reliability due to low thermal expansion and high thermal conductivity of alumina substrates ■ Reduction of management costs through simplified component management ■ Adjustments through operational trimming ■ Custom design enabling flexible circuit design *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Reduction of total manufacturing costs through the modularization of hybrid ICs!

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【Applications】 ◎In-vehicle equipment ◎Heating, ventilation, and air conditioning equipment ◎Wireless equipment ◎Amusement equipment ◎Industrial equipment ◎Electrical devices *For more details, please refer to the materials. Feel free to contact us as well.

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Hybrid IC

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Electronic material substrate "Alumina thick film printed substrate"

Electronic material substrate "Alumina thick film printed substrate"

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IAM

IAM Electronics Co., Ltd.

Industrial Electrical Equipment

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IAM Electronics Co., Ltd. has been engaged in the manufacturing of thick film electronic components since its establishment, growing as a key player in cutting-edge electronics with hybrid ICs, resistor networks, chip resistors, semi-fixed resistors, and chip resistor networks. Additionally, we have been working on steatite substrates, a type of ceramic for the electronics industry, since 1974, and began mass production of alumina ceramic substrates in 1984, achieving integrated production from materials to final products. Moving forward, we will continue to make efforts to contribute to the realization of a prosperous society through the electronics industry, manufacturing and selling even better products.

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