Granulation processing of fine powders into spherical particles with excellent fluidity. In addition to single compositions, it is also possible to achieve uniform spherical particle formation with multiple compositions. Various filler applications.
Microparticles have advantages such as high surface area and reactivity, but they often face challenges in fluidity due to issues like agglomeration. Our company utilizes spray granulation technology to create spherical granules, providing powders that maintain the characteristics of microparticles while ensuring high fluidity. In the thermal spraying materials where we have extensive experience, we have provided composite powders made from various materials such as ceramics, metals, and resins. The reasons for choosing spherical composite powders for thermal spraying include the ability to achieve both reactivity (fusibility) and fluidity, as well as the capability to supply different materials like ceramics and metals uniformly dispersed within the granules. Our Features: - We own all processes from granulation to sintering, classification, and analysis inspection equipment, allowing us to provide total solutions tailored to our customers' challenges. - We have obtained JIS Q9100 certification for thermal spraying materials aimed at the aerospace industry. - We have a strong track record of deliveries to the semiconductor industry, which requires high-quality management. Beyond thermal spraying applications, there is a growing demand for various composite particles, including metals and ceramics, as materials and fillers for 3D printers. We are committed to providing solutions with spherical composite powders, so please feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.