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  2. Electronic Components and Semiconductors
  3. フジミインコーポレーテッド
Electronic Components and Semiconductors
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フジミインコーポレーテッド

EstablishmentMarch 20, 1953 (Showa 28)
capital475343Ten thousand
number of employees1110
addressGifu/Kakamigahara-shi/Techno Plaza 1-8
phone058-379-3210
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last updated:May 07, 2026
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  • Products/Services(51)
  • catalog(44)
  • news(6)

フジミインコーポレーテッド Company Overview

We manufacture and sell abrasives and other products that cater to a wide range of fields.

Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

Business Activities

- Silicon wafer - Semiconductor device - Hard disk - Functional materials / New materials - Thermal spray materials

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Products/Services (51)

Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide. product image
Heat release and thermal conduction filler, cylindrical particles, thermal conductivity, zinc oxide.
May Ceramics Exhibition [Osaka] Exhibit Heat Dissipation Filler Rod-shaped Zinc Oxide product image
May Ceramics Exhibition [Osaka] Exhibit Heat Dissipation Filler Rod-shaped Zinc Oxide
Heat dissipation and thermal conduction filler, spherical silicon carbide (SiC) product image
Heat dissipation and thermal conduction filler, spherical silicon carbide (SiC)
【NEW】Heat dissipation and thermal conductivity filler - rounded silicon carbide (SiC) product image
【NEW】Heat dissipation and thermal conductivity filler - rounded silicon carbide (SiC)

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catalog(44)

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New Proposal for Heat Dissipation Filler: Introduction of Rounded Silicon Carbide

New Proposal for Heat Dissipation Filler: Introduction of Rounded Silicon Carbide

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Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

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Titanium Phosphate: A New Proposal as a Solid Lubricant - Plate-shaped Titanium Phosphate

Titanium Phosphate: A New Proposal as a Solid Lubricant - Plate-shaped Titanium Phosphate

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Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

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news(6)

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Notice of participation in the 11th Ceramics Exhibition at the High-Performance Materials Week from May 13 to 15 [Osaka].

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[May 13-15] Announcement of Participation in the 11th Advanced Ceramics Exhibition [Osaka] Our company will participate in the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held for three days from May 13 (Wednesday) to May 15 (Friday), 2026, at Intex Osaka (Hall 4, Booth No. K6-24). We will showcase various functional powders that we are developing at our booth. We invite you to visit our booth. ◆ 11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN ◆ Dates: May 13 (Wednesday) - May 15 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue and Our Booth Location: Intex Osaka, Hall 4, Booth No. K6-24 Official Website of the Advanced Ceramics Exhibition [Osaka]: https://www.material-expo.jp/osaka/ja-jp.html Registration is required for entry to the Advanced Ceramics Exhibition [Osaka]. Please obtain your visitor badge in advance from the link below before attending.

Mar 16, 2026

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Notice of Participation in Nanotech 2026 (January 28-30)

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We will be exhibiting at the "nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference" held at Tokyo Big Sight (West Hall 3, Booth No. 3W-H14) from January 28 (Wednesday) to January 30 (Friday), 2026. At our booth, we will showcase various functional powders that we are developing. We invite you to visit our booth. ◆nano tech 2026 International Nanotechnology Comprehensive Exhibition and Technical Conference◆ Dates: January 28 (Wednesday) to January 30 (Friday), 2026 Opening Hours: 10:00 AM to 5:00 PM Venue, Our Booth Location: Tokyo Big Sight, West Hall 3, Booth No. 3W-H14 Nanotech2026 Official Website: https://www.nanotechexpo.jp/ Registration is required for entry to nano tech 2026. Please obtain your visitor badge in advance and come to the event. https://unifiedsearch.jcdbizmatch.jp/nanotech2026/jp/invitation/5ayDY47cpRY

Dec 08, 2025

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Notice of Participation in the 10th Ceramics Exhibition (High-Performance Materials WEEK) to be held from November 12 to 14.

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We will be exhibiting at the "10th High-Performance Ceramics Exhibition CERAMIC JAPAN," which will be held from November 12 (Wednesday) to 14 (Friday), 2025, at Makuhari Messe (Exhibition Hall 2). Our booth will showcase various functional powders that we are developing. We invite you to visit our booth. ◆ 10th High-Performance Ceramics Exhibition CERAMIC JAPAN ◆ Dates: November 12 (Wednesday) to 14 (Friday), 2025 Opening Hours: 10:00 AM to 6:00 PM (ends at 5:00 PM on the final day) Venue: Makuhari Messe, Exhibition Hall 2 Booth Number: 9-13 Official Website of the High-Performance Ceramics Exhibition: https://www.material-expo.jp/tokyo/ja-jp.html Registration is required for entry to the High-Performance Ceramics Exhibition. Please obtain your visitor badge in advance from the link below and come to the event.

Sep 03, 2025

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Detailed information

Company name フジミインコーポレーテッド
number of employees1110
Contact addresspostalcode 509-0109 Gifu/ Kakamigahara-shi/ Techno Plaza 1-8View on map TEL:058-379-3210 FAX:058-260-3780
Business LocationsClick here for the list
Industry Electronic Components and Semiconductors
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