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last updated:Oct 13, 2026

フジミインコーポレーテッド
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Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

Introducing a 3D printer ultra-hard powder that achieves a hardness equivalent to HRA92! This is a presentation of a molded body made using a newly developed WC-TiC-Co based powder for additive manufacturing.

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Introduction of ultra-hard alloy powder developed for 3D printers.

Introduction of ultra-hard alloy powder developed for 3D printers.

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Technical Document) Volume 1: Characteristics of Hard Metals and Expectations for Layered Manufacturing (LPBF Method) / Efforts on Hard Metals × LPBF (Total of 5 Volumes)

Technical Document) Volume 1: Characteristics of Hard Metals and Expectations for Layered Manufacturing (LPBF Method) / Efforts on Hard Metals × LPBF (Total of 5 Volumes)

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Technical Document) 2nd Session: Challenges and Causes of Layered Manufacturing of Hard Alloys (LPBF Method), Powder Manufacturing Methods / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

Technical Document) 2nd Session: Challenges and Causes of Layered Manufacturing of Hard Alloys (LPBF Method), Powder Manufacturing Methods / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

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Technical Document) 3rd Session: The Effects of Heat Treatment Conditions After Additive Manufacturing of Cemented Carbide (LPBF Method) / Efforts on Cemented Carbide × LPBF (Total of 5 Sessions)

Technical Document) 3rd Session: The Effects of Heat Treatment Conditions After Additive Manufacturing of Cemented Carbide (LPBF Method) / Efforts on Cemented Carbide × LPBF (Total of 5 Sessions)

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Technical Document) 4th Session: The Effect of Carbon Content on Reducing Brittle Phases in the Layered Manufacturing of Hard Alloys (LPBF Method) / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

Technical Document) 4th Session: The Effect of Carbon Content on Reducing Brittle Phases in the Layered Manufacturing of Hard Alloys (LPBF Method) / Efforts on Hard Alloys × LPBF (Total of 5 Sessions)

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Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

Technical Document) Case Study on the Application of Laminated Manufacturing of Hard Alloys (LPBF Method) to Deep Drawing Press Molds / Efforts on Hard Alloys × LPBF (Total of 5 Parts)

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Electronic Components and Semiconductors

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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.

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