Actual display at the Ceramic Exhibition in Osaka: A high aspect ratio thermal filler that can be expected to improve thermal conductivity performance, such as TIM, by being added as a sub-filler.
We have released a new product for heat dissipation fillers, "Rounded Silicon Carbide," which combines high thermal conductivity and chemical stability, and excels in fillability and fluidity due to its rounded shape. ■Features - The high aspect ratio rounded rod shape makes it easy to form thermal conduction paths. - When combined with main fillers such as spherical alumina and aluminum nitride, a boosting effect on heat dissipation is expected. - The rounded edges derived from its crystal structure make it easy to fill into resins and other materials. Additionally, we will be exhibiting at the "11th Advanced Ceramics Exhibition [Osaka] CERAMIC JAPAN," which will be held at Intex Osaka for three days starting from May 13, 2026 (Wednesday). We will also explain the features and expected applications of our new product "Rounded Silicon Carbide" for heat dissipation fillers, so please take this opportunity to visit our booth!
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basic information
◆11th High-Performance Ceramics Exhibition [Osaka] CERAMIC JAPAN◆ Dates: May 13 (Wednesday) - 15 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue, Our Booth Location: Intex Osaka, Hall 4, Booth Number K6-24 Official Website of High-Performance Ceramics Exhibition [Osaka]: https://www.material-expo.jp/osaka/ja-jp.html Registration is required for entry to the High-Performance Ceramics Exhibition [Osaka]. Please obtain your visitor badge in advance from the link below and come to the event. https://www.material-expo.jp/osaka/ja-jp/register.html?code=1608140722197424-3HH *For more details, please download the PDF or feel free to contact us.*
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Applications/Examples of results
【Main Uses and Application Areas】 - TIM (Thermal Interface Material) and others Heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, heat dissipation gap fillers, sealing materials, etc. *For more details, please download the PDF or feel free to contact us.
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Company information
Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
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