[Nanotech2026 December Exhibition] A new heat dissipation filler that combines high thermal conductivity and chemical stability, featuring a rounded shape that excels in fillability and fluidity.
We have released a new product for heat dissipation fillers, "Rounded Silicon Carbide," which combines high thermal conductivity and chemical stability, and excels in fillability and fluidity due to its rounded shape. The newly developed "Rounded Silicon Carbide" has the following features: 【Features】 1. Optimized for fillers with a high thermal conductivity of 270 (W/m K) 2. Achieves low viscosity with a smooth filler surface 【Expected Applications】 - Products requiring TIM (Thermal Interface Material) and high fluidity, such as heat dissipation sheets, heat dissipation grease, heat dissipation adhesives, heat dissipation gap fillers, and sealing materials. For inquiries about the promising rounded SiC filler as a new thermal management material, please feel free to contact us. Additionally, we will be exhibiting at the "Nanotech 26th International Nanotechnology Exhibition and Conference" held at Tokyo Big Sight for three days starting December 16, 2026 (Wednesday). We will also explain the features and expected applications of our new product "Rounded Silicon Carbide" for heat dissipation fillers, so please take this opportunity to visit our booth!
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◆Nanotech 26th International Nanotechnology Exhibition & Conference◆ Date: December 16 (Wednesday) to 18 (Friday), 2026 Opening Hours: 10:00 AM to 5:00 PM Venue, Our Booth Location: Tokyo Big Sight, South Hall 3 & 4 [4th Floor], Booth Number 4S-Q04 Nanotech 26th International Nanotechnology Exhibition & Conference Official Website: https://www.nanotechexpo.jp Entry to the Nanotech 26th International Nanotechnology Exhibition & Conference requires visitor registration. Please obtain your visitor badge in advance from the link below and visit us. https://unified3.jcdbizmatch.jp/nanotech2026dec/Application/jp/nanotech/Visitor?_gl=1*6ikiyc*_gcl_au*NjQzOTU1MjY4LjE3OTAyMzU4NTM. *For more details, please download the PDF or feel free to contact us.
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【Main Applications and Fields of Application】 ■ Products requiring TIM (Thermal Interface Material) or high fluidity - Heat dissipation sheets - Heat dissipation grease - Heat dissipation adhesives - Heat dissipation gap fillers - Sealants, etc. ◆ Expected Application Fields - Various fields where heat generation countermeasures are important - Inverters for EVs - On-board power modules - LED substrates - Communication equipment, etc. *For more details, please download the PDF or feel free to contact us.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
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