It does not dissolve in many organic solvents! It has excellent heat resistance compared to general organic polymers.
The "MSP-N Series" consists of polymethyl silsesquioxane microparticles with a three-dimensional structure formed by siloxane bonds. Compared to general organic polymers, it exhibits excellent heat resistance and does not dissolve in many organic solvents. Additionally, we also offer composite particles called the "Silcrusta Series," which are coated with polymethyl silsesquioxane that has a three-dimensional structure formed by siloxane bonds. 【Features of the MSP-N Series】 ■ Excellent heat resistance compared to general organic polymers ■ Does not dissolve in many organic solvents *For more details, please refer to the PDF document or feel free to contact us.
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【Features of the Silcrusta Series】 ■ Superior heat resistance compared to conventional organic resin particles alone ■ Excellent light transmittance and light diffusion ■ Superior solvent resistance *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■MSP-N Series - Semiconductor encapsulants: Reduced stress, improved moisture resistance - Resist inks: Crack resistance - Optical applications: Light diffusion effect ■Silcrusta Series - Improvement of optical properties of various plastics *For more details, please refer to the PDF document or feel free to contact us.
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Our company specializes in the processing and sales of parts for OA equipment, communication devices, home appliances, and automobiles, primarily focusing on die-cut products. Leveraging the experience and knowledge we have cultivated since our establishment in 1963, we will continue to provide products that align with the needs of the times.