The coil material for the heat sink can be continuously processed up to a thickness of 5mm by adopting a progressive die! If you want to reduce costs and shorten delivery times, please feel free to consult with us.
The heat dissipation plate, known as a "heat sink," is primarily a metal "heat dissipation plate" that functions to transfer heat generated within semiconductor devices to the surrounding fluid (gas or liquid) to dissipate that heat. It is also capable of absorbing heat generated inside the semiconductor. Our company has 60 years of experience and has solved various challenges for our customers. We can accommodate micron-level flatness and specified warp processing, as well as resist baked printing. Please feel free to consult with us. 【Features】 ■ High dimensional and hole pitch accuracy due to precision total extraction molds ■ Continuous processing of coil materials up to a thickness of 5mm by adopting progressive molds ■ UV printing adopted ■ Capability for micron-level flatness and specified warp processing ■ Also supports resist baked printing *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ Base plate processing ■ Precision die cutting *For more details, please refer to the PDF document or feel free to contact us.
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At Mitsusho Manufacturing Co., Ltd., we handle a variety of products including resin molded items, electrodes, terminals, heat spreaders, and base plates. From mold design and manufacturing to pressing, leveling processing, degreasing cleaning, resist printing, (partner) plating, resin molding, quality control, and follow-up, our integrated production system enables the pursuit of total value creation. Please feel free to contact us if you have any requests.
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