SPL Series Carbon Dioxide Laser Processing Machine for Die Board Processing
Carbon dioxide laser processing machine for die board processing, model SPL2321D.
Achieving high-speed and high-quality cutting of die boards! The drive system uses an AC servo motor!
The "SPL Series" is a carbon dioxide laser processing machine that achieves high-speed and high-quality cutting of die boards. The "SPL3827D model" features an automatic air vice that suppresses material wobble and tilt. It is a high-precision model compatible with large cardboard and LCD film die cutting. In addition, we offer the "SPL3821D model," which significantly improves smoke exhaust capability with a new push-and-pull smoke exhaust mechanism, as well as the "SPL2321D model" and "SPL2425R model." 【Features of the SPL3827D model】 ■ High-precision model compatible with large cardboard and LCD film die cutting ■ High-rigidity frame that enables stable processing of large die boards ■ Automatic air vice that suppresses material wobble and tilt *For more details, please refer to the related links or feel free to contact us.
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basic information
【Specifications (Partial)】 ■Model: SPL3827D ■Rated Output: 1000W ■Processing Range: 2730 (X) × 1830 (Y) mm ■Rapid Feed Speed: 40m/min ■Number of Control Axes: 3 axes (X, Y, Z) ■Drive Method: AC Servo Motor ■Minimum Input Unit: 0.001mm *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
Line up（2）
| Model number | overview |
|---|---|
| SPL2321D/SSL1000 | Rated output 1000W Processing range 2100×1320mm |
| SPL2321D/SOL11HB | Rated output 1100W Processing range 2100×1320mm |
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Company information
Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.
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