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  6. Non-contact distortion and displacement measurement Digital Image Correlation method sDIC system

Non-contact distortion and displacement measurement Digital Image Correlation method sDIC system

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sDIC

last updated:Dec 13, 2024

西華デジタルイメージ
西華デジタルイメージ
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By measuring distortion and displacement through image measurement, it is possible to measure coordinates, displacement, velocity, distortion, shape, and deformation.

sDIC is a non-contact strain measurement software that analyzes the deformation and strain distribution of the measurement target using Digital Image Correlation (DIC). The Digital Image Correlation method involves applying a random pattern called a speckle pattern to the surface of the measurement target and comparing images before and after deformation to analyze the extent of deformation. It can detect not only the amount of deformation but also the direction of deformation. By performing sub-pixel interpolation, it achieves high-precision measurement with a displacement resolution of 1/10 to 1/100 of a pixel, which has garnered attention in recent years.

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measurement_dic_img_01.jpg

Non-contact distortion and displacement measurement Digital Image Correlation method sDIC system

measurement_dic_img_01.jpg
measurement_dic_img_01.jpg
  • Related Link - https://www.seika-di.com/measurement/material/dic.…

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basic information

Digital Image Correlation (DIC) is a method that involves applying a random pattern called a speckle pattern to the surface of the measurement target, and by analyzing images before and after deformation, it measures strain and displacement, visualizing the deformation. It is also referred to as DIC, which is an abbreviation for Digital Image Correlation. Unlike strain gauges, it analyzes strain and displacement through image analysis, allowing for the visualization of surface and three-dimensional strain in a non-contact manner. Seika Digital Image has established a development system for the strain analysis software sDIC and specializes in proposing systems tailored to customer needs. There is 'sDIC 2D,' which uses a single camera for two-dimensional (xy) analysis, and 'sDIC 3D,' which uses two cameras for three-dimensional (xyz) analysis, including depth direction. Additionally, we offer standalone 'sDIC software' for those who already have an image acquisition environment, as well as a complete 'sDIC system' that includes cameras, lenses, fixtures, lighting, and analysis PCs.

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P5

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Applications/Examples of results

Vehicle body and interior during operation Misalignment of engine and motor during operation, distortion of the case Vibration of the transmission during operation, misalignment and distortion of the housing Bulging during radiator pressurization, thermal deformation Deformation of brake pads during use Distortion of the arm under crane load Deformation of tire material under load Bending and tensile tests of hydrogen tank material (CFRP) Various tests including tensile, compression, bending, and thermal tests Various metals and solder, carbon materials Film and plastic resin materials Carbon materials (CFRP) Composite materials Deflection of bridges during vehicle passage Vibration of handrails and wind deflectors due to wind Vibration and deformation of piping Physical property evaluation of vibration-damping rubber Vibration of air conditioning housing, distortion of the compressor Deformation during destruction testing when a camera falls Temperature changes of wafers, destruction test analysis Temperature changes of electronic circuit boards, test analysis under pressure Temperature changes of capacitors Tensile, compression, bending, vibration, temperature changes High-speed testing Repeated testing, fatigue testing Micro tests under a microscope and electron microscope

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[Free WEB Seminar] Introduction to 3D Multipoint Vibration Measurement

[Free WEB Seminar] Introduction to 3D Multi-Point Vibration Measurement

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Vibration measurement is utilized in various fields and is one of the familiar measurement methods. Vibration pickups and laser vibrometers are widely used, and many of you may have experience with them. In recent years, we have seen an increase in inquiries regarding the spatial spread of vibrations and the analysis of three-dimensional vibration directions. In this seminar, we will introduce three-dimensional multi-point vibration measurement using imaging methods to respond to such needs. We will clearly present the advantages and disadvantages compared to laser vibrometers and vibration pickups, along with measurement examples. [Content of this seminar] Introduction to three-dimensional multi-point vibration measurement Presenter: Shinichi Matsushima ● Various methods used for vibration measurement ● Comparison of imaging methods, laser vibrometers, and vibration pickups ● Introduction of measurement examples ● Introduction of our products With the above points in mind, we are preparing to make this a meaningful seminar. We will also have a Q&A session, so we will answer any technical inquiries or questions you may have. We sincerely look forward to your participation and encourage you to invite others to join.

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[Free WEB Seminar] Session 7: Introduction to DIC (Digital Image Correlation)

  • Seminar・Event

In recent years, Digital Image Correlation (DIC) has gained attention as a non-contact method for measuring displacement and strain on object surfaces using images. To widely inform about what DIC is and what it can do, we will be holding a web seminar. ◎ Seminar Content ◎ Basics of DIC (Digital Image Correlation) → For those who want to start using DIC → For those interested in DIC We are preparing this seminar to be meaningful for everyone considering the points mentioned above. We will also have a Q&A session, so we will answer any technical inquiries or questions you may have. Additionally, this seminar is not a one-time event; we plan to hold them continuously, and we are also planning an advanced session (tentative) for the next time. Even if you cannot participate this time due to scheduling conflicts, we will have future opportunities available. We sincerely look forward to your participation and encourage you to invite others.

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西華デジタルイメージ

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We are waiting for your inquiries and consultations regarding our products and services, such as the following: ■ Particle Size Distribution and Powder Measurement - I want to replace my particle size analyzer, but it's too expensive to implement. - I want to introduce an easy-to-operate particle size analyzer. - I want to measure particle size distribution in the nano range at a low cost. ■ Fluid Measurement and Visualization - Concerns about the visualization and quantification of fluids. - I introduced PIV software, but I can't measure effectively. - I want to simultaneously measure the flow velocity and particle size of spray particles. ■ Strain and Displacement Measurement - I want to measure strain in areas where strain gauges cannot be attached. - I want to analyze strain and displacement non-contactly. - I want to measure the distribution of strain over a surface. ■ Thin Film and Porous Material Evaluation - I would like to consult about mercury porosimeters that will no longer be usable due to the Minamata Convention. - I want to evaluate the gas diffusion performance of GDL and MEA in fuel cells. - I want to measure the permeability of barrier films at high speed. We welcome any inquiries, no matter how trivial, so please feel free to consult with us. We also have a lab room available for demonstrations and product tours.

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