Supports both formic acid reduction and hydrogen reduction! A compact tabletop reflow device that achieves flux-free and void-free results is featured in many listings.
This catalog introduces the vacuum solder reflow devices handled by Unitec Japan Co., Ltd. Starting with the "VSS-450-300," which allows for easy temperature profile settings and is suitable for both small-batch production and mass production, we also feature models like the "RSS-210-S" and "RSS-160-S," which come standard with a viewing window and are perfect for research and development or prototyping. [Contents (excerpt)] ■ VSS Series ■ RSS Series ■ RSO Series *If you would like a copy of the catalog, please feel free to contact us.
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basic information
【Featured Products (Excerpt)】 ■VSS-450-300 ■RSS-210-S ■RSO-200 ■RSS-3x210-S *If you would like catalog materials, please feel free to contact us.
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P7
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![[Reflow Equipment Case Study] Temperature Variation within the Substrate](https://image.mono.ipros.com/public/catalog/image/01/ba2/675680/IPROS05055255908461765313.jpeg?w=120&h=170)
Company information
We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.
![Formic Acid Reduction Reflow Device [Case Study: Temperature Variation within the Substrate]](https://image.mono.ipros.com/public/product/image/1d6/2000750698/IPROS84633161574523479179.png?w=280&h=280)
