ユニテンプジャパン Company Profile

Introducing the tabletop vacuum solder reflow device compatible with formic acid reduction, as well as the tabletop vacuum process high-speed heating furnace!

We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.