Solved with the Unitemp reflow device! Significant high-speed cooling! A cooling rate of nearly 3°C per second from solder melting to solidification!
When molten solder takes too long to cool and solidify, it negatively affects the solder joint strength and electrical characteristics. It is a problem if the characteristics deteriorate due to cooling speed issues. Our reflow equipment is equipped with an active water cooling system using circulating cooling water as standard. This allows us to maximize the solder characteristics after reflow. [Case Summary] ■ Issue: If the molten solder takes too long to cool and solidify, it negatively impacts the solder joint strength and electrical characteristics. ■ Solution: - Standard equipped with an active water cooling system using circulating cooling water. - This not only improves the strength and electrical characteristics of the solder but also reduces the tact time. *For more details, please refer to the PDF document or feel free to contact us.
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.