Formic Acid Reduction Reflow 【Case Study: Voids Trapped Inside Solder】

Solve it with the Unitemp reflow device! Vacuum (decompression) is possible even when the chamber is at high temperature after reaching the melting point!

When X-raying the state after the solder has solidified, there are cases where something resembling bubbles appears within the solder, which is referred to as "voids." If the solder solidifies with these voids remaining, the joint strength and electrical characteristics deteriorate. It is essential to ensure that voids are removed during the process. Our reflow equipment can accommodate a vacuum (reduced pressure) environment of up to 10^-3 hPa, allowing for the evacuation of voids. It is possible to create a profile that allows for the solder to be heated to its melting point after establishing a vacuum state, and also to perform vacuum evacuation while the solder is in a molten state. [Case Overview] ■ Issue - If the solder solidifies with voids remaining, the joint strength and electrical characteristics deteriorate. ■ Solution - By performing vacuum evacuation (reduced pressure) while the solder is molten, voids can be actively removed from the molten solder. *For more details, please refer to the PDF document or feel free to contact us.

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