Presenting case studies on problem-solving! Achieving high-reliability implementation with zero voids and zero flux residue through formic acid reduction. Suitable for mass production with rapid heating and cooling!
The "VSS-450-300" is a tabletop vacuum solder reflow device that flexibly accommodates various applications, including solder reflow, oxidation-reduction processing, and paste sintering. With an effective heating area of 300×300×50mm, it can easily handle the mounting of tall components. 【Features】 - Compatible with both fluxless solder (reduction method) and flux-containing solder - Achieves a maximum temperature of 450°C despite its tabletop size - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow - Supports rapid cooling through a water cooling system *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 - The working area is gas shielded, making it suitable for processes that are sensitive to contamination and other critical processes. - Heating is performed by an infrared (IR) heater from below, allowing for precise and rapid heating. - By combining with an appropriate vacuum pump, a vacuum environment of up to 0.1Pa (10^-3 hPa) can be achieved. - Equipped with a standard touch panel monitor, enabling easy operation through touch controls. - Up to 50 temperature control programs with 50 segments (lines) can be registered in the main unit. - Various trigger modes are available, including elapsed time, chamber temperature, and chamber vacuum level. Scheduled to exhibit at the 2nd NEPCON Japan [Autumn] Dates: September 13 (Wed) to September 15 (Fri), 2023 Venue: Makuhari Messe Booth: 7-41 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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![[Reflow Equipment Case Study] Temperature Variation within the Substrate](https://image.mono.ipros.com/public/catalog/image/01/ba2/675680/IPROS05055255908461765313.jpeg?w=120&h=170)
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.
![Formic Acid Reduction Reflux Device [Case Study: Flux Residue]](https://image.mono.ipros.com/public/product/image/08b/2000750667/IPROS02087092152301234872.png?w=280&h=280)
