BGA-style connector connection! Implementation balls that are pressed without metal melting.
"MR-BGA" is a mounting ball that allows for implementation simply by forming a metal film on a rubber ball instead of melting metal. Since it can be joined at room temperature, it enables the mounting of components that are sensitive to heat. Additionally, because it is not melted, it can be removed and used like a connector. The shape and size are similar to BGA solder balls, but the connection process is based on contact pressure, similar to a connector process. It features a low resistance of 5mΩ, excellent high-frequency characteristics, no reflective noise, a transfer speed of 25Gbps, and outstanding durability against vibration. [Features] - Low contact pressure of 5g per pin - Cold and heat resistance from -40°C to 200°C, with a momentary tolerance of 300°C *For more details, please download the PDF or contact us.
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【Specifications】 ■Size: 300μm to 800μm ■Resistance value: 5mΩ at 3% deformation ■Contact pressure: 5g ■Deformation limit: 30% ■Thermal characteristics: -40℃ to 200℃, momentarily 300℃ ■High-frequency characteristics: 25Gbps *For more details, please download the PDF or contact us.
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Build-up of printed circuits, sensors, and substrates, as well as sensors that are weak against flexibility and thermal stress, are increasing the demand for low-temperature mounting. The MR-BGA, which can be connected completely at room temperature, has a metal film formed on micro rubber balls and can connect with low resistance and high high-frequency characteristics simply by being sandwiched where connection is desired. Additionally, since it is only sandwiched, it can also be disassembled, allowing for connector-like usage. Its heat resistance is compatible with solder reflow, enabling work to be done without separating it from other mounting processes.