リトルデバイス Company Profile

Metal film rubber ball MR-BGA that can be implemented at room temperature.

Build-up of printed circuits, sensors, and substrates, as well as sensors that are weak against flexibility and thermal stress, are increasing the demand for low-temperature mounting. The MR-BGA, which can be connected completely at room temperature, has a metal film formed on micro rubber balls and can connect with low resistance and high high-frequency characteristics simply by being sandwiched where connection is desired. Additionally, since it is only sandwiched, it can also be disassembled, allowing for connector-like usage. Its heat resistance is compatible with solder reflow, enabling work to be done without separating it from other mounting processes.