Plastic for laser direct structuring with heat resistance of 260℃.
"TECACOMP LDS" is a thermoplastic high-performance compound that enables the formation of extremely fine wiring due to its microstructure. This allows for compatibility with applications that require miniaturization. With an optimized compound formulation, wiring with strong adhesion and durability can be achieved. 【Features】 ■ It has heat resistance up to 260°C and is compatible with conventional plating technologies. ■ Fine wiring down to 70μm can be achieved with an appropriate filler formulation. ■ PEEK and LCP grades realize high dimensional stability with low thermal expansion coefficients. ■ PPA grade improves cooling performance due to good thermal conductivity. *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Enables the realization of MID technology ■ Achieves not only weight reduction but also cost reduction ■ Additives in the polymer are activated by laser irradiation ■ In the electroless copper plating process, copper plating adheres to the activated wiring sections *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Enzinger Japan Co., Ltd. of the Enzinger Group manufactures and sells PEEK resin materials for machining, such as PEEK rods and PEEK sheets. In particular, PEEK sheets are highly regarded for having "extremely low internal stress" and "minimal warping, making it easy to achieve precise dimensions." The high technical expertise developed with PEEK is applied to the extrusion of crystalline resins such as nylon, PET, POM, and PP, providing machining-friendly resin materials. Additionally, we also offer machining materials for super engineering plastics such as polyimide, Ultem, and PPSU, in addition to PEEK.
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