Achieving fine three-dimensional MEMS structures through plating! It realizes high heat dissipation and can accommodate large currents.
The "Mmemus substrate" is a heat dissipation substrate for high-brightness, high-current LEDs that integrates unique plating technology with MEMS technology to accommodate various electronic devices. It achieves fine three-dimensional MEMS structures through plating. Vertical fine plating with pattern widths of several tens of micrometers is possible using semiconductor photoprocessing. High-speed film formation through plating allows for the creation of fine three-dimensional thick film structures over 50μm in thickness, and by using a unique seed layer, high reliability is achieved. 【Features】 ■ Thick film structure unique to plating (over 50μm) ■ Dense, low-stress, and high adhesion is possible - Can be created on nitrogen aluminum substrates with excellent insulation and heat resistance ■ Achieves high heat dissipation and can handle high currents - Mounting substrates for LD/LEDs and power supply circuits - MEMS components such as micro springs/switches and package cap arrays *For more details, please refer to the PDF document or feel free to contact us.
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Our company primarily specializes in surface treatment through ultra-precision plating. Among our offerings, the lens molds, ultra-thick films, and electroless nickel plating "Hainop" have a proven track record of over 20 years. Additionally, by applying appropriate pre-treatment, we can achieve thick plating on difficult-to-plate materials such as carbide, titanium, glass, and ceramics while maintaining adhesion that withstands processing. We welcome inquiries such as, "Can you plate on such base materials?" Please feel free to contact us.
![[Examples of Using Mmems Substrates] High Thermal Dissipation Substrate for High Brightness LEDs](https://image.mono.ipros.com/public/product/image/6b7/2000462778/IPROS66024267372851426525.png?w=280&h=280)
