High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

Achieving fine three-dimensional MEMS structures through plating! It realizes high heat dissipation and can accommodate large currents.

The "Mmemus substrate" is a heat dissipation substrate for high-brightness, high-current LEDs that integrates unique plating technology with MEMS technology to accommodate various electronic devices. It achieves fine three-dimensional MEMS structures through plating. Vertical fine plating with pattern widths of several tens of micrometers is possible using semiconductor photoprocessing. High-speed film formation through plating allows for the creation of fine three-dimensional thick film structures over 50μm in thickness, and by using a unique seed layer, high reliability is achieved. 【Features】 ■ Thick film structure unique to plating (over 50μm) ■ Dense, low-stress, and high adhesion is possible - Can be created on nitrogen aluminum substrates with excellent insulation and heat resistance ■ Achieves high heat dissipation and can handle high currents - Mounting substrates for LD/LEDs and power supply circuits - MEMS components such as micro springs/switches and package cap arrays *For more details, please refer to the PDF document or feel free to contact us.

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