Significant time reduction and accurate buffer design will be possible!
Tohoku Ueno will assist you in reducing costs through packaging design. By converting the process of measuring physical items to data input, significant time savings can be achieved. Additionally, by reading actual product data, accurate cushioning design becomes possible. 【Features】 ■ Assistance in cost reduction through packaging design ■ Packaging design utilizing simulation technology ■ Faster packaging design through reverse engineering technology ■ Significant time savings possible ■ Accurate cushioning design possible *For more details, please refer to the external link or feel free to contact us.
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【Introduction to Reverse Engineering】 ■STEP1 ・Digitize the physical object using 3D scanning ■STEP2 ・Import the 3D data as is ■STEP3 ・3D design using a surfacer ■STEP4 ・Design directly without measurements ■STEP5 ・Prototype and issue specifications *For more details, please refer to the external link or feel free to contact us.
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Whether it is [one-way] or [commuting], whether cushioning is necessary, and the effects of static electricity... the optimal materials vary depending on the contents. We will propose improvements to the packaging format for the 2024 issue. Tohoku Ueno Co., Ltd. will utilize the many packaging examples we have cultivated so far and various new materials developed in recent years to solve environmental issues, offering the best combinations. We will consider all aspects, including cost, material selection, processing methods, and environmental factors, to meet our customers' needs. We will conduct drop tests using the drop tester from Ransomont, analyze the shock waveforms with test partners, and propose optimal cushioning packaging designs.