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  6. [Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

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last updated:Mar 14, 2025

一般財団法人材料科学技術振興財団 MST
一般財団法人材料科学技術振興財団 MST
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We will evaluate the internal structure of the device in a comprehensive manner.

MST offers a range of technologies suitable for evaluating the internal structures of electronic devices, and we propose analytical methods tailored to the observation field and objectives. This document presents case studies investigating specific areas of devices using X-ray CT and FIB-SEM. First, we observed the internal structure of the entire sample using X-ray CT to explore specific areas. Next, we used FIB-SEM to examine the detailed structures of the specific features identified on the vias.

    Other electronic partsContract Analysis
C0536.jpg

[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM

C0536.jpg
C0536.jpg
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Analysis of electronic components.

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[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM_C0536

[Analysis Case] Investigation of Voids Inside Bonded Wafers Using C-SAM_C0536

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一般財団法人材料科学技術振興財団 MST

一般財団法人材料科学技術振興財団 MST

Testing, Analysis and Measurement

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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!

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