Atel, which has developed various units, will solve the problem of transporting difficult special wafers!
Devices used in power devices and MEMS are all special types. Many of them are difficult to handle and involve various challenging sensing capabilities. Our company believes that "ensuring the reliable transport of these special wafers is our mission." It is a given that we do not break them, and we have developed various units that can meet special requests such as "handling only around the wafer." Therefore, we confidently assert that we can handle difficult and special wafers, including Taiko wafers, thin wafers of 80μm or less, wafers that are warped by more than 15mm, SiC wafers, and quartz wafers. 【Supported Special Wafers】 ■ Taiko wafers ■ Thin wafers of 80μm or less ■ Wafers warped by more than 15mm ■ SiC wafers ■ Quartz wafers *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Transport and inspection of special wafers *For more details, please refer to the PDF document or feel free to contact us.
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Our company is developing, designing, and manufacturing inspection equipment for special wafers that cannot be inspected by conventional inspection devices, as well as laser marker combined inspection devices and various loaders, based on the clean transport technology we have cultivated over many years in the semiconductor manufacturing field. From both the perspective of accommodating special wafers and automating visual inspections, we are commercializing products that meet our customers' needs for "equipment that is necessary but not available anywhere."