Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300
VSS-300
300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.
This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*
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basic information
【Specifications (Excerpt)】 ■Device Size (WxDxH): 550mm × 690mm × 830mm ■Device Weight: Approximately 105kg ■Effective Object Size (WxDxH): 300mm × 300mm × 50mm ■Maximum Reach Temperature: 450℃ ■Heating Method: Cross-arrangement IR heater (bottom heating) ■Temperature Control Method: P.I.D. control method ■Temperature Difference on Plate Surface: Within ±1% of set temperature (Object: Φ300mm wafer) ■Maximum Heating Rate (depending on the thermal capacity of the object): 150K/min. ■Maximum Cooling Rate (depending on the thermal capacity of the object): 90K/min. (T=450℃>200℃), 60K/min. (T=200℃>100℃) ■Chamber Vacuum Durability: 0.1Pa (10-3hPa) ■Nitrogen Gas: 0.35 to 0.4MPa (3.5 to 4bar) ■Controller: 7-inch touch panel controller (SIMATIC TP-700) ■Number of Profile Program Registrations: Up to 50 programs ■Chamber Cooling Method: Water jacket method ■Heating Plate Cooling Method: Water cooling/Air cooling (can be shared) *For more details, please refer to the PDF document or feel free to contact us.
Price information
5 million to 15 million yen (depending on the model and options)
Delivery Time
※The delivery time is approximately 3 to 4 months from the confirmation of your order (please contact us for more details, as the delivery time may vary depending on the situation).
Applications/Examples of results
【Applications】 ■ Solder reflow mounting without using flux ■ Functional material development fields (battery electrodes, conductive film materials, etc.) ■ Redox of metal surfaces such as electrodes and metal powders ■ Redox during sintering of silver nano and copper nano pastes (not just prevention) 【Delivery Achievements】 ■ Automotive industry (power devices for EV/HV and high-brightness LED mounting) ■ Medical applications (pacemakers, endoscopes, etc.) ■ Aerospace development industry (radar, satellites, rockets, etc.) ■ Government-affiliated research institutions such as AIST and NICT, as well as national universities and private universities in engineering departments *For more details, please refer to the PDF materials or feel free to contact us.
Line up（7）
| Model number | overview |
|---|---|
| VSS-300 | |
| RSO-200 | |
| RVS-210 | |
| RSS-3×210-S | |
| RSS-210-S | |
| RSS160-S | |
| RSS110-S |
catalog（2）
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Company information
We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.
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