We accept laser processing of alumina, aluminum nitride, silicon carbide, and others!
Our company is a venture established under the support of the Graduate School of Light Industry Creation, following the independence of the laser technology division of Alps Engineering. We specialize in processing fine holes and thin ceramics, and we have been developing processing methods to handle functional ceramics that are difficult to process outside of laser processing, which requires heat resistance and electrical properties in recent years, accumulating achievements. [Examples of Processing and Achievements (Excerpt)] ■ Hole processing in alumina ■ Silicon wafer marking ■ Sapphire cutting processing ■ Groove processing in single crystal SiC ■ SEM images of ALN processed surfaces *For more details, please refer to the PDF document or feel free to contact us.
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【Other Processing Examples and Achievements】 ■ SiC Groove Processing ■ Alumina Shaped Processing ■ Silicon Substrate Hole Processing ■ Silicon Mask Processing ■ Si Resizing Processing ■ Si Wafer Shaped Cutting ■ Single Crystal SiC Scribing *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company is a venture established under the support of the Graduate School of Light Industry Creation, following the independence of the Laser Technology Division of Alps Engineering. Specializing in microfabrication, we not only offer contract laser processing but also accept prototype processing for future product design and various research applications.
![UV laser processing [High frequency / 5G compatible substrate processing]](https://image.mono.ipros.com/public/product/image/d66/2000522208/IPROS65502204341964517942.jpeg?w=280&h=280)
![Micron-level precision, high difficulty × short delivery time! Precision cutting processing [Processing case examples available].](https://image.mono.ipros.com/public/product/image/2070746/IPROS9035842601074547405.png?w=280&h=280)