ナノプロセス Product Lineup

Our company is a venture established with the support of the Graduate School of Light Industry Creation, following the independence of the Laser Technology Division of Alps Engineering. We are capable of processing not only representative resins such as polyimide and PET but also new materials. Even with conventional materials, we can perform laser-specific processing such as miniaturization of product sizes and removal of metal films from resins. 【Processing Examples and Achievements】 ■ Polyimide removal processing on copper foil ■ Cutting processing with a line width of 30μm ■ Step processing of polyimide ■ Polyimide removal processing on copper foil ■ Cutting at a width of 100μm *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Resin mold

Our company is a venture established under the support of the Graduate School of Light Industry Creation, following the independence of the laser technology division of Alps Engineering. We specialize in processing fine holes and thin ceramics, and we have been developing processing methods to handle functional ceramics that are difficult to process outside of laser processing, which requires heat resistance and electrical properties in recent years, accumulating achievements. [Examples of Processing and Achievements (Excerpt)] ■ Hole processing in alumina ■ Silicon wafer marking ■ Sapphire cutting processing ■ Groove processing in single crystal SiC ■ SEM images of ALN processed surfaces *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Our company specializes in microfabrication, utilizing various types of laser oscillators such as picosecond, nanosecond, and microsecond pulse lasers, as well as carbon dioxide lasers, to meet specific requirements. The materials we handle include a wide range of metals, silicon, silicon carbide (SiC), various types of glass, polymer materials such as resins, and we excel in processing tungsten, molybdenum, and titanium, which are difficult to machine, as well as other brittle materials. Of course, we will also accommodate materials beyond those mentioned as much as possible, so please feel free to consult with us. 【Features】 ■ Capable of deep holes, deep grooves, and through processing with a high aspect ratio in areas of microfabrication that were previously impossible ■ By selecting the appropriate laser, we can accommodate all types of materials ■ No preceding or following processes are required, allowing for a short processing time ■ The cutting allowance is extremely small, enabling efficiency in material usage and quantity during cutting *For more details, please download the PDF or feel free to contact us.

• Processing Contract