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  6. Laser microprocessing: carbide chip breaker (groove) processing

Laser microprocessing: carbide chip breaker (groove) processing

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last updated:Sep 18, 2019

光機械製作所 HIKARI LASER LAB.
光機械製作所 HIKARI LASER LAB.
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Laser microprocessing: carbide chip breaker (groove) processing

Grooves were processed at the tip of a carbide cutting tool using an ultra-short pulse laser. This improves the discharge of "chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as PCD (polycrystalline diamond) and CBN (polycrystalline cubic boron nitride). In this way, by applying fine processing with a laser, it is also possible to enhance functionality. Material: Carbide

    Drive system partsOther machine toolsProcessing Contract
超硬x2.jpg

Laser microprocessing: carbide chip breaker (groove) processing

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超硬x2.jpg

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Grooves were processed at the tip of a carbide cutting tool using an ultra-short pulse laser. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as PCD (polycrystalline diamond) and CBN (polycrystalline cubic boron nitride). In this way, by applying fine processing with a laser, it is also possible to enhance functionality. Material: Carbide

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Material: Super hard

catalog(4)

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Characteristics and History of Ultrashort Pulse Lasers

Characteristics and History of Ultrashort Pulse Lasers

TECHNICAL
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Internal Modification of Glass by Laser Micromachining and Principles of Marking

Internal Modification of Glass by Laser Micromachining and Principles of Marking

TECHNICAL
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Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

TECHNICAL
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Laser microfabrication: Through holes in glass.

Laser microfabrication: Through holes in glass.

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Company information

光機械製作所

光機械製作所 HIKARI LASER LAB.

Manufacturing and processing contract

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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!

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