Glass epoxy (Galaepo) molding processing for semiconductor device mechanical components.
Resin cutting processing
The pipes made using the hand lay-up method are also ideal for mechanical parts that require geometric tolerances.
Components used in semiconductor devices require high-precision processing. This product is made from a glass-epoxy pipe created using the hand lay-up method, which has been machined using a CNC lathe and machining center, and has undergone keyway processing. As it is a component used for shafts, geometric tolerances are required for the inner diameter holes, which were made slightly smaller and then machined using a CNC lathe. The pipes made using the hand lay-up method have uniform stress, and due to their mechanical strength and dimensional stability, they can be processed with high precision without distortion. We have a proven track record in a wide range of fields and applications, from custom-made products used in heavy electrical, railway, and telecommunications to reinforcement plates for electronic components' FPCs, so please feel free to consult with us.
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basic information
Leveraging extensive experience gained from many years in the electronic components industry, we are capable of not only selling resin materials tailored to customer requests but also providing a wide variety of processing services. 【Material Sales: We can handle various resin materials and metals from general-purpose engineering plastics to super engineering plastics】 ○ Thermosetting resin laminated sheets and molded sheets ○ Thermosetting resin laminated round bars and pipes ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics ○ Super engineering plastics ○ Copper-clad laminated sheets ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing: We provide cost performance that meets customer problem-solving and needs】 ○ Precision punching processing (various laminated sheets, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ Functional film lamination processing ○ Optical film vacuum lamination processing for curved surfaces ○ Contract development of jigs and devices ● For more details, please contact us.
Price information
Please contact us.
Delivery Time
※Delivery times may vary depending on size, shape, and quantity, so please feel free to contact us.
Applications/Examples of results
Mechanism components of devices, etc.
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.
