By eliminating back alignment, we achieved a low price and compact design, making it an ideal device for small-batch production of various types.
The "AMA6000" is an automatic batch equal exposure mask alignment device. The ASAP mask aligner manages the gap between the mask and the wafer in a completely non-contact manner. While it can operate in non-contact mode, it also supports soft and hard contact. It achieves low cost, compact size, and easy operation. 【Features】 ■ Parallel exposure in complete non-contact ■ Space-saving & easy maintenance ■ Auto alignment ■ Achieves low cost and compact design, suitable for small-batch production of various types *For more details, please refer to the PDF document or feel free to contact us.
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【Main Specifications】 ■ Mask Size: □3" to □7" ■ Wafer Size: Φ2" to Φ6" ■ Equipment Size: 1200×1200×1900 (Main Unit) ■ Transport Method: Double Arm Clean Robot (Class 1 Compatible) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We specialize in the design, manufacturing, and sales of photoresist coating, exposure, and development equipment, as well as photolithography processes in general, including double-sided exposure devices. In particular, we possess high uniformity coating technology for substrates with uneven surfaces or V-grooves, as well as for square and irregularly shaped substrates. Furthermore, we have developed and are selling a peeling and lift-off device that prevents the occurrence of burrs and metal reattachment using high-pressure jet NMP. Additionally, we handle various coating devices such as polyimide, PBF, OCD, WAX, high-temperature baking devices, and spin dryer devices. We customize equipment according to customer specifications and budgets. We also sell various wafers and substrates.