Achieving high-precision and low-cost 3D packaging in HBM and FO-WLP with C2W processing services!
Our company, which specializes in W2W bonding, offers C2W processing services. We address issues such as alignment discrepancies in W2W and improve efficiency and power savings compared to conventional technologies, including wire bonding. We achieve high-precision and low-cost 3D packaging in HBM and FO-WLP. 【Features】 ■ C2W TB support through high-precision alignment ■ High-efficiency stacking through parallel C2W ■ Efficiency improvements through the expansion of C2W to W2W bonding *For more details, please refer to the PDF document or feel free to contact us.
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【Expansion of W2W bonding technology to C2W】 ■ Ultra-high precision (±0.5μm) TB ↓ ■ Pre-bonding treatment: Cleaning, CMP, Activation ↓ ■ Bonding: Room temperature bonding, Plasma, Activation bonding ↓ ■ Various methods DB ↓ ■ Further stacking * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While various structures such as MEMS devices and TSVs are being examined, we are developing appropriate CMP slurries in-house to accommodate the CMP processes of next-generation devices and are providing CMP contract processing tailored to our customers' needs. We not only handle mass production processing from a few prototypes to tens of thousands of units but also conduct technical transfers (CMP process transfers).