Plating treatment for LCP film with excellent high-frequency characteristics and dielectric properties! Development of a process that combines surface modification ensuring high adhesion and electroless plating.
Since 2020, following 4G, 5G mobile communication services have also started in Japan. 5G not only enables ultra-high-speed communication but also features ultra-low latency that allows for smooth operation of robots and other devices even in remote locations, as well as the ability to connect multiple smartphones and computers simultaneously. Currently, high-frequency compatible substrates using low-dielectric materials such as LCP and fluoropolymer resins are attracting attention as suitable materials for high-speed transmission. In particular, liquid crystal polymer (LCP) has excellent electrical properties in the high-frequency range, low moisture absorption, and superior dimensional stability, leading to its increasing adoption for 5G and millimeter-wave applications. Our company has developed a process that combines surface modification and plating to ensure high adhesion for LCP, which is said to be difficult to achieve with copper plating.
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basic information
In the conventional microwave band, flame-resistant glass substrate epoxy resin laminates (such as FR-4 materials) and glass cloth substrate polyphenylene ether (PPE), polyimide (PI) films have been used as materials for printed circuit boards. The top LECS process is an electroless copper plating process developed specifically for the new material LCP (liquid crystal polymer). This process is a direct plating method that does not use copper foil, allowing for the formation of circuits on LCP film without the need for large and expensive equipment, unlike dry methods (such as vapor deposition and sputtering). This process combines surface modification and plating, and after uniformly and finely roughening the surface layer of LCP, it forms a dense plating film with low stress, demonstrating high adhesion strength of over 6N/cm even after applying thermal stress (150°C for 72 hours) while maintaining low roughness. It is compatible with roll-to-roll methods and semi-additive processes, and since the entire process can be achieved using wet methods, it contributes to improved productivity and finer wiring.
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Okuno Pharmaceutical Industry's surface treatment chemicals, plating chemicals, and various glass products are widely used in smartphones, semiconductors, electronic components, automobiles, and machine parts. We also offer a variety of chemicals for final surface treatment, so please feel free to consult with us.
Company information
Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.
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