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  6. Micro-hole processing, glass, quartz, ultra-short pulse laser, cutting

Micro-hole processing, glass, quartz, ultra-short pulse laser, cutting

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last updated:Dec 18, 2019

光機械製作所 HIKARI LASER LAB.
光機械製作所 HIKARI LASER LAB.
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Micro-hole processing, glass, quartz, ultra-short pulse laser, cutting.

【Micro Hole Processing Glass Quartz Ultra-Short Pulse Laser Cutting】 【Material】 Glass Quartz 【Industry and Applications】 Medical devices and medical parts related industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Features】 This product uses ultra-short pulse laser technology to process micro holes in glass. It enables small diameter hole processing with minimal burrs. It is compatible with drilling holes in various types of glass, with a minimum hole diameter of approximately 0.1mm. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwa-no-ha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

    Beverage Production EquipmentLaser markerContract manufacturing
Trimming_circle_fai0.5_1.0_2.0_3.0_cut.jpg

Micro-hole processing, glass, quartz, ultra-short pulse laser, cutting

Trimming_circle_fai0.5_1.0_2.0_3.0_cut.jpg
Trimming_circle_fai0.5_1.0_2.0_3.0_cut.jpg

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【Micro Hole Processing Glass Quartz Ultra-Short Pulse Laser Cutting】 【Material】 Glass Quartz 【Industry and Applications】 Medical devices and medical parts related industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Features】 This product uses ultra-short pulse lasers to process micro holes in glass. It enables small diameter hole processing with minimal burrs. It is compatible with drilling holes in various types of glass, with a minimum hole diameter of approximately 0.1mm. ◆ Microprocessing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

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【Micro Hole Processing Glass Quartz Ultra-Short Pulse Laser Cutting】 【Material】 Glass Quartz 【Industry and Applications】 Medical devices and medical parts related industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Features】 This product uses ultra-short pulse laser technology to create micro holes in glass. It allows for small diameter hole processing with minimal burrs. It is compatible with drilling holes in various types of glass, with a minimum hole diameter of approximately 0.1mm. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

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Laser microfabrication: Through holes in glass.

Laser microfabrication: Through holes in glass.

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Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

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Internal Modification of Glass by Laser Micromachining and Principles of Marking

Internal Modification of Glass by Laser Micromachining and Principles of Marking

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Characteristics and History of Ultrashort Pulse Lasers

Characteristics and History of Ultrashort Pulse Lasers

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Company information

光機械製作所

光機械製作所 HIKARI LASER LAB.

Manufacturing and processing contract

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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!

Product/Service List (42)

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