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  6. Laser micro holes φ100μm alkaline-free glass quartz

Laser micro holes φ100μm alkaline-free glass quartz

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last updated:Dec 03, 2019

光機械製作所 HIKARI LASER LAB.
光機械製作所 HIKARI LASER LAB.
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Laser micro holes φ100μm alkaline-free glass quartz

【Laser Micro Holes φ100μm Non-Alkali Glass Quartz】 【Material】 Non-Alkali Glass 【Industry and Applications】 Medical Devices Communication Equipment 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has a material thickness of 0.5mm and a hole diameter of 100μm. It enables small diameter hole processing with minimal burrs. It is compatible with drilling various types of glass (quartz). It can accommodate minimum hole diameters of approximately 0.1mm. Microprocessing of Difficult-to-Cut Materials and Shapes ◆ Automotive Parts, Medical Device Parts, Electronic Components, Semiconductor Components ◆ Prototype and Development Projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

    Other optical partsOther markingsProcessing Contract
無アルカリガラス0.5mm_hole.jpg

Laser micro holes φ100μm alkaline-free glass quartz

無アルカリガラス0.5mm_hole.jpg
無アルカリガラス0.5mm_hole.jpg

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【Laser Micro Holes φ100μm Non-Alkali Glass Quartz】 【Material】 Non-Alkali Glass 【Industry and Applications】 Medical Devices Communication Equipment 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has a material thickness of 0.5mm and a hole diameter of 100μm. It enables small-diameter hole processing with minimal burrs. It is compatible with drilling various types of glass (quartz). It can accommodate minimum hole diameters of approximately 0.1mm. Microprocessing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

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【Laser Micro Holes φ100μm Non-Alkali Glass Quartz】 【Material】 Non-Alkali Glass 【Industry and Applications】 Medical Devices Communication Equipment 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has a material thickness of 0.5mm and a hole diameter of 100μm. It enables small-diameter hole processing with minimal burrs. It is compatible with drilling various types of glass (quartz). It can accommodate minimum hole diameters of approximately 0.1mm. Microprocessing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

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Laser Micromachining Thin Film Processing Case Studies Thickness Below 50μ

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Characteristics and History of Ultrashort Pulse Lasers

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Company information

光機械製作所

光機械製作所 HIKARI LASER LAB.

Manufacturing and processing contract

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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!

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