Micro through-hole processing (TGV)

The substrate types include alkaline glass and heat-resistant glass! Achieving long, narrow fine hole drilling.

At Musashino Fine Glass, we have developed a technology that performs etching after modifying the glass using lasers. By irradiating with ultra-short pulse lasers, we create regions with different physical properties within the glass, allowing us to etch into the desired shapes. This processing method, which combines "laser" and "etching," enables the realization of long and narrow fine hole drilling that was previously difficult to achieve. 【Examples of Achievements】 ■ Aspect ratio of approximately 5, substrate thickness 0.4mm, hole diameter φ80μm ■ Aspect ratio of approximately 7.5, substrate thickness 0.6mm, hole diameter φ80μm ■ Aspect ratio of approximately 2.8, substrate thickness 0.5mm, hole diameter φ180μm *For more details, please refer to the PDF document or feel free to contact us.

Processing Contract