【Technology Introduction】SMT Process

Directly mount semiconductor components onto the solder of PCB surface electrodes! Chip components and irregularly shaped components can be mounted on the surface of the PCB!

We would like to introduce the SMT process technology of Niigata Seimitsu Co., Ltd. In the SMT process, we accommodate high-density and closely spaced mounting, and we can also handle solder repair. Furthermore, we are capable of providing the necessary circuit board design for high-density and closely spaced mounting. Additionally, we can comprehensively handle other processes related to the SMT process, such as circuit board cleaning, dicing, and underfill, all in-house. 【Features】 ■ Printing paste solder on the electrodes of printed circuit boards (PCBs) ■ Directly mounting semiconductor components, etc., onto the solder on the PCB surface electrodes ■ Solder connection methods ■ Lead-free solder compatibility ■ Capability to mount chip components and irregular components on the PCB surface *For more details, please refer to the PDF document or feel free to contact us.

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