COB high-density packaging contract manufacturing *Case study materials available for problem-solving

We accept module development, prototyping to evaluation, and mass production! We offer proposals with our unique know-how. *We are currently providing helpful materials such as the "High-Density Implementation Specification Sheet" and "Problem-Solving Case Studies."

We utilize the technology accumulated through various achievements to propose unique design and implementation know-how, covering package structures, joining methods, and material selection. We support flip chip technologies such as C4 joining, thermal compression bonding using NCP resin, ultrasonic GGI joining, and Au-Au thermal compression bonding. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in joining methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.

Circuit board design and manufacturingOther mounting machines