イデアシステム Product Lineup

Are you having trouble with mixed COB and SMD mounting? Our company offers hybrid technology that allows for high-precision mounting of COB (Chip On Board) and SMD (Surface Mount Devices) on the same substrate. In module products that are becoming smaller and more functional, we simultaneously achieve space-saving, high reliability, and thermal design compatibility. We have a proven track record in various industries, including LED modules, sensors, and medical and automotive devices. We can provide one-stop support from design and prototyping to mass production. Please feel free to consult with us! 【Features】 ■ Comprehensive support for COB + SMD mixed mounting ■ Suitable for compact, high-density circuit design ■ Many achievements in LED, sensor, and automotive modules ■ Prototypes and short delivery times are acceptable 【Use Cases and Expected Applications】 ■ Development of compact, high-output LED modules ■ Spatial optimization design on IoT sensor boards ■ Ultra-compact mounting for medical probes and wearable devices *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines

We propose unique design and implementation know-how using technologies accumulated through various achievements, covering package structures, bonding methods, and material selection. We support flip chip bonding, including C4 bonding, thermal compression using NCP resin, ultrasonic GGI bonding, and AuAu thermal compression. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in bonding methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines

This document includes information on "High-Density Packaging Specifications." It provides a list of materials, wire diameters, pad sizes, pitches, and other details related to the wire bonding process in wire assembly. Additionally, information on bump assembly and flip chip assembly is also presented in table format. Please feel free to consult us about any content not listed in the provided sizes. [Contents Included] ■ Wire Assembly ■ Bump Assembly ■ Flip Chip Assembly *For more details, please download the PDF or feel free to contact us.

• Other contract services

We would like to introduce a case of high-density wire bonding with a chip-to-chip distance of 0.2mm. In order to increase the communication speed of optical communication modules (PD-TIA) as much as possible, we received an inquiry about whether it was possible to reduce the distance between the optical devices and the transceiver ICs, thereby bringing the chip-to-chip distance even closer. Thanks to the precise implementation by our skilled in-house technicians, we were able to reduce the distance between the chips from 0.5mm to 0.2mm, successfully achieving a faster communication module. [Case Overview (Partial)] ■ Implementation Method - Wire Bonding = Wire Bonder - Resin Coating = Manual Dispenser ■ Board Size: 121mm x 177mm x 1mm (6-layer board) ■ Board Material: MEGTRON6 (Glass Cloth) *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce a case study of wire bonding and flip chip hybrid mounting of optical devices (VCSEL chips). We received an inquiry about creating a module that incorporates optical waveguides within a flexible substrate and delivers optical signals from the light-emitting and receiving devices mounted on the substrate to a connector directly connected to the substrate. We visited a partner company with a high-performance mounter to oversee the assembly and set conditions, confirming the state after position-specific mounting. We were able to manufacture an optical communication module that meets the customer's required specifications. [Case Overview (Partial)] ■ Mounting Method - Wire Bonding = Wire Bonder - IC Mounting = Flip Chip Bonder - Resin Sealing = Manual Dispenser *For more details, please refer to the PDF document or feel free to contact us.

• Other optical parts

We would like to introduce a case study on improving the heat dissipation and bonding strength of substrates through void reduction. To efficiently transfer the temperature during chip operation, we received an inquiry about using a high thermal conductivity material for the bonding between the plate and the base plate. By using a high thermal conductivity adhesive sheet, we improved the thermal conductivity. Additionally, by scrubbing the chip during solder melting, we successfully reduced the voids that were present inside the solder during the initial melting. 【Case Overview】 ■ Mounting Method: Flip Chip Mounting ■ Substrate Size: Plate 25mm x 25mm x 3mm, Base Plate 40mm x 40mm x 3mm ■ Substrate Material: Both the plate and base plate are aluminum (with Ni plating treatment on the entire surface) ■ Lot Quantity: A few pieces (for sampling) ■ Delivery Time: 1.5 months including preliminary evaluation *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

We would like to introduce a case study on module production using a small CMOS image sensor. The customer had the challenge of wanting to fit a very small image sensor into a space of □1.5mm and a length of 5mm or less, aiming for device miniaturization. Since bending the module can easily cause cracks, the CMOS mounting section and the ceramic capacitor mounting section were placed on separate substrates and later soldered together. This approach allowed for a reduction in size compared to previous models while also achieving strength at the joint, significantly reducing the occurrence of cracks at the joints. 【Case Overview】 ■ Mounting Method: Soldering ■ Substrate Size ・Φ1.35mm×0.2mm ・2mm×1mm×0.2mm ■ Substrate Material: Glass epoxy substrate ■ Lot Size: 5 to 10 units *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts

Our company manufactures and assembles various electronic devices for small satellites. We offer products such as the "Power Control UNIT," which is equipped with functions like solar cell power input circuits, as well as the "Shunt DISSIPATOR" and "On BOARD Computer." This enables the adoption of industrial products, cost reduction, and shorter delivery times. 【Features】 ■ Designed for small satellites ■ Manufacturing/assembly of various electronic devices ■ Cost reduction and shorter delivery times possible ■ Proven track record in space applications for industrial products ■ Major components are sourced from space-grade parts *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other contract services

The Idea System realizes your "wants" in product planning, prototyping, development, and commercialization. Please feel free to consult us at any stage or in any field, from upstream design. We will assist your manufacturing with our "responsiveness," "proposal capabilities," and "technical expertise." With a trinity design system, we consistently bring products to market, including reliability testing and environmental testing. 【Areas of Expertise】 ■ Sensor Control ■ Mechatronics ■ IoT ■ Electronic Circuit Design ■ Software Design ■ Mechanical Design ■ Manufacturing *For more details, please refer to the PDF materials or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines
• Other contract services

If you have any issues with manufacturing, please consult us. Idea System will propose and solve them with five strengths. We offer a one-stop solution for manufacturing with over 30 years of cultivated technology and experience, along with a diverse network. 【Solutions with Five Strengths】 ■ Development Capability - Circuit design, software design, PCB design, mechanical design ■ Procurement Capability - Electronic components, PCBs, cables, assembly parts ■ Production Capability - SMT, high-density mounting, rework, assembly ■ Responsiveness - Delivery times, after-sales support, evaluation/analysis, tool production ■ Management Capability - Material management, delivery management, quality management *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines

We utilize the technology accumulated through various achievements to propose unique design and implementation know-how, covering package structures, joining methods, and material selection. We support flip chip technologies such as C4 joining, thermal compression bonding using NCP resin, ultrasonic GGI joining, and Au-Au thermal compression bonding. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in joining methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines

We propose unique design and implementation know-how using the technology accumulated through various achievements, covering package structure, bonding methods, and material selection. With our technical expertise and know-how in bonding methods for semiconductor bare chips, measurement, inspection, and reliability evaluation, we support our customers in solving their challenges. 【Challenges → Solutions】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Other mounting machines

Idear is dedicated to the development and manufacturing of products and systems that meet our customers' wants. We aim to be a 2.5-dimensional industry-type company that sources existing products and creates those that do not exist. We will assist you in building systems as a good partner for your company. 【Business Activities】 ■ Development, manufacturing, and sales of the image monitoring system "TELEC-EYE" ■ Contract development and manufacturing of electronic devices ■ Prototyping and mass production of high-density mounting ■ Development and manufacturing of system-in-package ■ Sales of LEDs ■ Manufacturing of welfare equipment *For more details, please refer to the PDF materials or feel free to contact us.

• Circuit board design and manufacturing
• EMS
• Surveillance Camera System