[Example] Module production using a small CMOS image sensor

Soldering a separate board to a CMOS-equipped board! A successful example of achieving special product specifications.

We would like to introduce a case study on module production using a small CMOS image sensor. The customer had the challenge of wanting to fit a very small image sensor into a space of □1.5mm and a length of 5mm or less, aiming for device miniaturization. Since bending the module can easily cause cracks, the CMOS mounting section and the ceramic capacitor mounting section were placed on separate substrates and later soldered together. This approach allowed for a reduction in size compared to previous models while also achieving strength at the joint, significantly reducing the occurrence of cracks at the joints. 【Case Overview】 ■ Mounting Method: Soldering ■ Substrate Size ・Φ1.35mm×0.2mm ・2mm×1mm×0.2mm ■ Substrate Material: Glass epoxy substrate ■ Lot Size: 5 to 10 units *For more details, please refer to the PDF document or feel free to contact us.

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