Hybrid implementation service of COB and SMD | Achieving miniaturization and high functionality

Added to bookmarks
Bookmarks list

Bookmark has been removed
Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.
Free membership registration

last updated：Jun 05, 2025

イデアシステム

Official site

Are you having trouble with COB and SMD on separate lines? Optimize costs and processes with consolidated mixed loading! *One-stop support from prototypes.

Are you having trouble with mixed COB and SMD mounting? Our company offers hybrid technology that allows for high-precision mounting of COB (Chip On Board) and SMD (Surface Mount Devices) on the same substrate. In module products that are becoming smaller and more functional, we simultaneously achieve space-saving, high reliability, and thermal design compatibility. We have a proven track record in various industries, including LED modules, sensors, and medical and automotive devices. We can provide one-stop support from design and prototyping to mass production. Please feel free to consult with us! 【Features】 ■ Comprehensive support for COB + SMD mixed mounting ■ Suitable for compact, high-density circuit design ■ Many achievements in LED, sensor, and automotive modules ■ Prototypes and short delivery times are acceptable 【Use Cases and Expected Applications】 ■ Development of compact, high-output LED modules ■ Spatial optimization design on IoT sensor boards ■ Ultra-compact mounting for medical probes and wearable devices *For more details, please refer to the PDF document or feel free to contact us.

Related Link - http://www.idea-gr.co.jp/

Inquire About This Product

basic information

【Other Contract Development Services】 ■ Procurement of substrates (LTCC/FPC rigid-flex/metal substrates/Si substrates/interposers) ■ Support for modularization through SMT mixed mounting, as well as MEMS and optical devices ■ Wafer processing ■ BGA package reballing and rework ■ Conducting environmental tests such as PCT and TCT in a consolidated manner to verify reliability 【Case Studies for Problem Solving】 ■ Want to use FC but can only obtain chips individually → Bump formation on individual pieces using a bump bonder ■ Implementing in overseas factories but yield is not improving → Reassessing conditions within our company. Reproducing NG and pointing out areas for review *For more details, please refer to the PDF document or feel free to contact us.