Below t1.6! Here are examples of data specifications for BGA-mounted substrates.
This document presents examples of board data specifications for BGA mounted boards with a pitch of 1.6 mm or less. It introduces various specifications, starting with "4-pitch BGA mounted through resin-filled boards," "0.5-pitch BGA mounted through resin-filled boards," and the main specifications of build-up boards. We encourage you to read it. [Contents] ■ Through boards (Recommended design specifications for BGA section) ■ Build-up boards (Recommended design specifications for BGA section) *For more details, please refer to the PDF document or feel free to contact us.
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【Publication Content Overview (Excerpt)】 ■ Through Hole Substrate (Recommended Design Specifications for BGA Section) - 0.4mm pitch BGA mounted through resin-filled substrate - 0.5mm pitch BGA mounted through resin-filled substrate - 0.65mm pitch BGA mounted through resin-filled substrate ■ Build-Up Substrate (Recommended Design Specifications for BGA Section) - Main specifications of our build-up substrate - 0.4mm pitch BGA mounted - 0.5mm pitch BGA mounted (Recommended design specifications for 0.5mm pitch section) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Daishin Sangyo Co., Ltd. is a trading company that has been selling products related to electrical and electronic goods for many years. We offer a wide and rich selection of products, ranging from FA products, printed circuit boards, equipment, to various processed goods. Based on our experience and knowledge, we propose appropriate plans to our customers.