Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.
Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■BGA Pad: φ0.3 (Resist opening φ0.32) ■Resist: Laser exposure using DI ■Laser hole diameter: φ0.1 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Daishin Sangyo Co., Ltd. is a trading company that has been selling products related to electrical and electronic goods for many years. We offer a wide and rich selection of products, ranging from FA products, printed circuit boards, equipment, to various processed goods. Based on our experience and knowledge, we propose appropriate plans to our customers.