[Published in Nikkei Sangyo Shimbun] Supporting the digital society with fine wiring technology.

A technology for forming wiring with plating on ultra-thin copper foil! Introducing a method advantageous for fine wiring of circuits.

The Nikkei Sangyo Shimbun has featured our company's development of "MSAP." "MSAP" is a technology that forms wiring through plating on ultra-thin copper foil. It is a method advantageous for fine wiring of circuits, enabling the miniaturization of products. Shinko Seisakusho is developing high-density, high-reliability printed circuit boards that consider environmental impact using this technology. In addition to the developing "MSAP," we will provide thin, high-density printed circuit boards through processing technology for ultra-thin materials at the micron level and build-up technology. For more details, please download and view the PDF. 【MSAP Features】 ■ Copper is built up through plating to form wiring in necessary areas ■ A method advantageous for fine wiring of circuits ■ Enables product miniaturization ■ Efficient use of resources *For more details, please refer to the PDF document or feel free to contact us.

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