"Supporting the digital society with fine wiring technology" has been published in the Nikkei Industrial Newspaper!

Our company’s development of "MSAP" was featured in the Nikkei Sangyo Shimbun.
"MSAP" is a technology that forms wiring through plating on ultra-thin copper foil. It is a method advantageous for fine wiring of circuits, enabling the miniaturization of products.
Shinko Manufacturing Co., Ltd. will provide high-density and high-reliability printed circuit boards that are environmentally friendly using this technology.
*For more details, please refer to the related products and catalog, or feel free to contact us.

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