Miniaturization of products through fine wire technology! Reducing environmental impact by adopting selective plating methods.
We would like to introduce 'MSAP', which is handled by Shinko Seisakusho Co., Ltd. The product is miniaturized through fine wiring, and environmental impact is reduced by adopting selective plating methods. The applications include module substrates and high-frequency compatible substrates. The PDF document below provides detailed information about 'MSAP', so please download it and take a look. 【Features】 ■ Miniaturization of products through fine wiring ■ Adoption of selective plating methods ■ Reduction of environmental impact ■ Applications include module substrates and high-frequency compatible substrates *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■L/S (Cu≦10µmt): 10/25 ■L/S (Cu 15µmt): 20/30 ■L/S (Cu 35µmt): 35/35 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Seisakusho Co., Ltd. operates as a company within the Sumitomo Metal Mining Group, primarily engaged in the development, design, manufacturing, and sales of electronic circuit boards. Our company conducts integrated production across all processes from design to prototype and mass production. Additionally, we not only focus on domestic production but also select overseas OEM partners according to our customers' needs for procurement and sales. If you have any inquiries regarding electronic circuit boards, please feel free to consult with us.
![[Published in Nikkei Sangyo Shimbun] Supporting the digital society with fine wiring technology.](https://image.mono.ipros.com/public/product/image/0f6/2000744307/IPROS99628200140249235669.png?w=280&h=280)
