Jet dispense paste compatible with high-speed ejection at a dot diameter of Φ150μm.
"winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components that cannot be printed, such as three-dimensional structures, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are difficult to print (such as those that warp or shrink). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.
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We provide high-performance solder that meets global standards.