Not only improved wettability but also enhanced reliability! It is possible to efficiently discharge voids.
The "LFM-48 NH-GE(H)" is a dual boost solder paste that achieves the wettability equivalent to ROL1 while maintaining high reliability of non-halogen paste. It adopts the new technology "Dual Boost," which solves various issues associated with non-halogen paste. This is a unique technology from Almit that combines both fast and slow activation. Even under stringent reflow conditions such as atmospheric reflow and long preheating, it demonstrates melting properties that non-halogen pastes typically lack. 【Features】 ■ High reliability under high temperature and sealed environments ■ Reduction of BGA pillow defects ■ Good melting properties for micro solder joints ■ Reduction of voids *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Company information
Japan Almit Co., Ltd. is constantly improving its response and organizational structure to ensure sincere communication with customers not only in Japan but also around the world. We are committed to enhancing quality and developing a sales information system, focusing on meticulous responses and services. Moving forward, as a company with a global vision that harmonizes with the Earth's environment and connects joy to the next generation, we will actively set high goals for coexistence with the planet and work towards the development of society and the dissemination of technology for the future.
