[Introduction of Latest Technology] ECON's Underwater Cutter

Excellent maintainability with a simple piping layout! The heat-insulated die plate allows for granulation at low resin pressure with different types of nozzle loading.

Introducing our "Underwater Granulation Device." The heat-insulated die plate allows for granulation at low resin pressure by loading different types of "nozzles." Its structure, which is less affected by circulating water, eliminates the need for a temperature control bypass pipe, resulting in a simple piping layout. The "nozzle" not only allows for changes in the diameter of the polymer outlet but also enables adjustments to the "internal pressure" by altering the angle of the internal flow wall. [Features] ■ The heat-insulated die plate enables granulation at low resin pressure by loading different types of "nozzles." ■ Its structure is less affected by circulating water, eliminating the need for a temperature control bypass pipe. ■ Simple piping layout. ■ Adjustments to the "internal pressure" are possible by changing the angle of the internal wall. * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.

Granulating Equipment