By utilizing our "TOM method," waterproofing of circuit boards becomes easy!
We propose the waterproof barrier 'TOM Waterproof,' which is gaining attention as an application using the "TOM Method." There is no need for drying time or cases for pouring resin. The film is about 150μm thick, so the weight hardly changes. Additionally, we offer our developed "3D Laser Trimming Machine" for unnecessary film trimming processes. 【Features】 ■ The appearance of the product remains almost unchanged, and the weight is also nearly the same. ■ Solvent-free, considering the environment. ■ Multiple small items can be produced at once. ■ Manufacturing processes are faster as mixing, degassing, and drying of two components are unnecessary. ■ The functionality of the film used adds functional properties to the product. *For more details, please download the PDF or contact us.
Inquire About This Product
basic information
【Applied Technology】 ■ By sealing with a black film, it is possible to turn the substrate and components into a black box. ・ As a heat dissipation measure for capacitors, resistors, and LED elements, there are films that convert heat into light energy for heat dissipation. * For more details, please download the PDF or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or contact us.
catalog（1）
Download All Catalogs
Company information
Busei Vacuum Co., Ltd. is highly regarded as an innovative company that combines a molding processing division with a manufacturing division for molding machines, aimed at developing processing technologies related to thermoforming and realizing the concretization of those technologies. In pursuit of further development, we have established the next-generation molding (NGF molding) technology to explore the market for environmentally conscious decorative technologies. As an alternative processing method to painting and plating, it is being recognized for its future potential across the entire industry as a surface treatment method that enhances the functionality of the base materials for fork products.