Equipped with multiple laser emission units! Since external stress does not occur, it suppresses burrs and cracks.
At Hitachi High-Tech, we handle "Laser Slitters." Using a laser beam, we perform non-contact slitting on films with difficult-to-process functional coatings that are layered with blades. Our special laser optical system reduces thermal effects at the processing area. 【Features】 ■ For functional films ■ Equipped with multiple laser emission units ■ Reduces burrs and cracks due to the absence of external stress ■ Reduces thermal effects at the processing area with a special laser optical system ■ Output control that follows processing speed *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Maximum processing speed: 120m/min ■ Laser wavelength: 9.4μm or 10.6μm ■ Laser output: 350W (automatic correction) ■ Processing width control: ±0.1mm ■ Dust collection airflow: up to 10m³/min ■ Equipped with focal position adjustment mechanism *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The corporate philosophy aims to be a company that is "trusted" by all stakeholders, and through business activities based on "value creation" using high-tech solutions, it contributes to the progress and development of society. Currently, we are engaged in global business development across five segments: "Electronic Device Systems," "Finetech Systems," "Scientific and Medical Systems," "Industrial and IT Systems," and "Advanced Industrial Materials." We will also organically integrate "trading company functions" and "manufacturing functions" to respond to our customers' needs as an advanced technology company.