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  6. MEMS foundry services (wafer contract processing services)

MEMS foundry services (wafer contract processing services)

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last updated:Mar 10, 2020

日本MEMS
日本MEMS
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3D implementation services (implementation services using TSV technology, etc.)

We offer a wide range of services from partial process contracting for MEMS to overall development prototyping and mass production foundry. We can accommodate all requests through our MEMS line network, ranging from 2-inch and irregular substrates to 12-inch (300mm). Please feel free to consult us for exposure, etching contract processing, and film deposition services starting from a single piece. This is a full-fledged foundry service dedicated to MEMS. 【Service List】 - PZT Film Deposition Service Supports 4, 5, 6, and 8 inches using sputtering method. - Si Deep Etching Service Supports 2 to 12 inches. - Low-Temperature CVD Film Deposition Service below 100°C Supports 2 to 6 inches. - 8-inch and 12-inch MEMS Foundry Service Capable of manufacturing MEMS for large chips. *For more details, please download the PDF.

    WaferPrototype Services
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MEMS foundry services (wafer contract processing services)

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  • Related Link - http://www.jmems.com/foundry.htm

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Engineering Examples (6-inch Line) 1) Photo Process 2) Thin Film Deposition 3) Dry Etching Process 4) Bulk MEMS Support 5) Wafer Bonding ● For more details, please contact us.

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MEMS foundry services (wafer contract processing services)

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日本MEMS

日本MEMS

Electronic Components and Semiconductors

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Japan MEMS Corporation partners with domestic and international MEMS and semiconductor foundry companies to meet all requests from development to mass production of MEMS. We also respond to all requests related to semiconductor processes.

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