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  5. Extrusion Machine
  6. PCS Series Mixing Extruder for Semiconductor Encapsulation Materials

PCS Series Mixing Extruder for Semiconductor Encapsulation Materials

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PCS Series Mixing Extruder for Semiconductor Encapsulation Materials

last updated:Jan 14, 2021

ブッス・ジャパン
ブッス・ジャパン
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A continuous kneader optimal for compounds of semiconductor encapsulants based on thermosetting resins, achieved through precise temperature control.

Epoxy molding compound (EMC) is an optimal encapsulant for protecting various electronic components such as integrated circuits (ICs), diodes, transistors, and semiconductors. Its excellent electrical, mechanical, and chemical properties make this material suitable for electrical products and automotive applications. To fully utilize the outstanding quality of EMC, a kneading device that can effectively disperse high-fill fillers under low and fully controlled temperature conditions is required. Buss's kneading technology has continued to meet such advanced demands for the past 60 years, and its high performance has been demonstrated in the molding of compounds based on thermosetting resins such as epoxy resins, phenolic resins, polyester resins, melamine resins, and urea resins.

    Extrusion MachineResin processing machineRubber Processing Machine
EMC

PCS Series Mixing Extruder for Semiconductor Encapsulation Materials

EMC PCS Photo.jpg
EMC PCS Photo.jpg
  • Related Link - https://busscorp.com/jp/industries/thermosets/

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basic information

(Main Features) - Powerful dispersion mixing at low temperatures - Uniform and moderate shear rate - Accurate temperature control - High filler loading rate - High wear-resistant elements (Technical Data) Screw diameter: 70mm, 100mm, 140mm, 200mm Effective screw length: 8 L/D or 14 L/D Maximum screw rotation speed: 250 rpm Maximum processing capacity: 1800 kg/h (PCS200)

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Semiconductor encapsulation compound based on thermosetting resins such as epoxy resin, phenolic resin, polyester resin, melamine resin, and urea resin.

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2020 PCS Catalog for Semiconductor Packaging Materials

2020 PCS Catalog for Semiconductor Packaging Materials

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ブッス・ジャパン

ブッス・ジャパン

Industrial Machinery

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Buss AG, headquartered in Switzerland, has been manufacturing and selling continuous kneading extruders that play a crucial role in various compounding processes involving chemical materials such as plastics and rubber, as well as food, for over 70 years. Buss was the first in the world to introduce a unique continuous kneading extruder using the reciprocating motion of a single-screw, and has long been known as the Buss Ko-Kneader. It has gained immense trust from customers who require precise temperature control and produce shear-sensitive materials. This has enabled it to thrive in various chemical manufacturing settings, including PVC, polypropylene, PET, thermoplastic elastomers, XLPE, flame-retardant cables, masterbatches, powder coatings, and toners. Together with a global sales network and partners, Buss provides reliable and efficient technology along with top-class after-sales service.

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